Single, two, four and six layer PCBs of the following specifications

SMOBC-HAL-PISM finishes.
Lead-Free HAL solder.
Electroless Nickel and immerson Gold.
Selective electroplated Nickel and Gold plating.
PCB thickness – 0.8 mm / 1.6mm / 2.4mm / 3.2mm.
Copper clad thickness – 18 / 35 / 70 micron.
Base laminates - FR-2 / CEM1 / FR-4.
CNC routing / V-grooving for panels.
 
 
Technical Specifications

All boards tested on bare board testing machine. Facility to do double sided simultaneous testing of SMD pads.

Copper plating thickness – minimum 25 microns inside holes.
Checking equipment – available.

Minimum hole size - 0.4mm (finished).
Minimum conductor width – 6 MIL.
Minimum gap between conductors – 6 MIL.
Minimum pitch of SMD IC – 20 MIL.
Minimum SMD pin width – 10 MIL.
Maximum board size - 580 X 460 mm.

Tolerance on hole diameter –
Upto 0.8 mm - + 0.05 mm.
0.9 to 2 mm – + 0.1mm.
Above 2 mm – + 0.15mm.

Tolerance on PCB profile - + 0.2mm.
CNC routing and V grooving for panels.
 
Specification followed
IPC-A-600F
JSS-52301, 52302
 
                  
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